| Items | Items Maximum Capabilities | |
|---|---|---|
| Product Size | 558×643mm、488×676mm、φ520mm | |
| Layer Count | 102 | |
| Board thickness | 7.65mm | |
| Drill Diameter | φ0.08～φ6.35 | |
| Fine Pitch Technology |
0.25mm pitch／φ0.08 drill 0.30mm pitch／φ0.10 drill 0.35mm pitch／φ0.15 drill |
HDI Proto：4lams 0.4mm pitch／φ0.1LVH MP：3lams 0.4mm pitch／φ0.1LVH |
| Aspect Ratio |
Board thickness 3.0t ／Drill dia. φ0.08 A／R=38 Board thickness 6.35t／Drill dia. φ0.15 A／R=42 Board thickness 7.65t／Drill dia. φ0.20 A／R=38（With Flip-drilling） |
|
| Structure | IVH, HDI:UV-YAG/CO2 LVH, Flex-rigid, Aluminum Core/Base | |
| Impedance | Standard ±10％ Option：±8％、±5％ | |
| Material | FR-4, High TgFR-4, Low DK/DF/PTFE | |
| Surface Finish | Electrolytic/Electroless Ni-Au Plating, Ni-Pd-Au Plating, OSP Eutectic /Pb-free HASL | |
| Others | Flatness ≦2mil, Back-drilling (Stub length +0/-0.3mm), Milling, Counterbore/sink processing, Cavity, Heat radiation: Copper Invar, Copper Coin, Composite Material | |
| Items | Description |
|---|---|
| Product Size | 558×643mm、488×676mm、φ520mm |
| Max layers | Less than 126L |
| Board thickness | 7.4 ±0.3mm |
| VIA structure | PTH, PAD on VIA、BVH (Two time lamination) |
| Material | No restriction (Megton6、Hight Tg FR4) |
| Items | Description |
|---|---|
| Product Size | 610×483mm |
| Layers | 70 layers |
| Board thickness | 6.35 ±0.3mm |
| Pad pitch | 0.34mm |
| Material | No restriction (Megton6、Hight Tg FR4) |
| Others | Blind VIA, Back drill |
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